Quality Assurance Provisions |
At Presidio Components, all QPL testing per MIL-STD-202 is done on site at our DSCC approved test lab.
Every lot undergoes the following inspection and tests: |
Thermal Shock — All parts are temperature cycled for 5 cycles to Mil-Std-202 Method 107, Condition A, except that the maximum temperature used is 125°C. Voltage Conditioning — A voltage bias is applied to all parts at rated voltage and 125°C for 100 hours. Capacitance — All parts are tested at 25°C and 1VACRMS in accordance with method 305 of Mil-Std 202. Dissipation Factor (DF) — Shall not exceed 2.5% for BR and BZ dielectric or 0.15% for BP dielectric. Dielectric Withstanding Voltage (DWV) — All parts rated at 1250V or less are tested at 1.5X rated voltage and parts rated at 1251V or greater are tested at 1.2X rated voltage IAW method 301 of Mil-Std-202. Insulation Resistance (IR @ 25°C) — All parts are tested at 25°C and 500 volts IAW method 302 of Mil-Std-202. The minimum IR required is 100,000 megohms or 1,000 megohm-microfarads whichever is less. Percent Defective Allowed (PDA) — The cumulative PDA after voltage conditioning is 10%. Pieces rejected as out of tolerance for capacitance or visual screening will be removed from the lot but not counted in the PDA calculation. Partial Discharge (Corona) — Inspection shall be performed IAW Appendix B of Mil-PRF-49467 at 42% of rated voltage. Radiographic Inspection Optional — For molded and encapsulated case types only. All parts will have radiographic inspection performed IAW Mil-STD-202 Method 209. Visual — Performed on all pieces IAW Presidio internal workmanship criteria. Mechanical — Level 1 AQL 1% IAW this catalog. |
Standard Packaging |
Product will be packaged in individual blister packs. |
Data Package |
Data will be sent with each shipment including: |
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MIL-PRF-49467C Group A Inspection |
Inspection |
Requirement Paragraph |
Test Method Paragraph |
Sampling Procedure |
Subgroup 1 |
Thermal Shock |
3.6 |
4.8.2.1 |
100% Inspection |
Voltage Conditioning |
3.6 |
4.8.2.2 |
|
Partial Discharge
(When specified, see 3.1) |
3.10 |
4.8.6 |
|
Subgroup 2 |
Radiograph Inspection1 |
3.24 |
4.8.20 |
See Table V |
Subgroup 3 |
Visual and
Mechanical Examination:2 |
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Material |
3.4 and 3.4.1 |
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Physical Dimensions |
3.1 |
4.8.1 |
13 Samples, 0 Failures |
Interface Requirements |
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(other than physical dimensions)2 |
3.5 |
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Marking3 |
3.25 |
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Workmanship |
3.27 |
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Subgroup 4 |
Solderability4 |
3.13 |
4.8.9 |
5 Samples, 0 Failures |
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1 |
Molded and encapsulated case types only, see 3.1. Not applicable to conformal coated parts. |
2 |
The manufacturer may request the deletion of the visual and mechanical examination provided an in-line or process control system to assure the visual and mechanical requirements are met can be validated and approved by the qualifying activity. Deletion of these examinations does not relieve the manufacturer from meeting these requirements in case of dispute. If the design, material, construction, or processing of the part is changed or if there are any quality problems, the qualifying activity may require resumption of these examinations. |
3 |
Marking defects are based on visual examination only. |
4 |
Defective units from subgroups 1 and 2 tests may be used. Parts subjected to this test shall not be delivered. The manufacturer may request the deletion of the subgroup 4 solderability test, provided an in-line or process control system for assessing and assuring the solderability of leads can be validated and approved by the qualifying activity. Deletion of the test does not relieve the manufacturer from meeting this test requirement in case of dispute. If the design, material, construction, or processing of the part is changed or if there are any quality problems, the qualifying activity may require resumption of the test. |
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